Array of triangular semiconductor dies



FIG. 1 is a top plan view of a first embodiment of an array of triangular semiconductor dies showing our new design;

FIG. 2 is a front perspective view thereof;

FIG. 3 is a rear perspective view thereof;

FIG. 4 is a top plan view of a second embodiment of an array of triangular semiconductor dies showing our new design;

FIG. 5 is a front perspective view thereof;

FIG. 6 is a rear perspective view thereof;

FIG. 7 is a top plan view of a third embodiment of an array of triangular semiconductor dies showing our new design;

FIG. 8 is a front perspective view thereof;

FIG. 9 is a rear perspective view thereof;

FIG. 10 is a top plan view of a fourth embodiment of an array of triangular semiconductor dies showing our new design;

FIG. 11 is a front perspective view thereof;

FIG. 12 is a rear perspective view thereof;

FIG. 13 is a top plan view of a fifth embodiment of an array of triangular semiconductor dies showing our new design;

FIG. 14 is a front perspective view thereof; and,

FIG. 15 is a rear perspective view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design. The triangular semiconductor dies is shown broken away in FIGS. 1-15 to indicate that no particular length is claimed. 

CLAIM The ornamental design for an array of triangular semiconductor dies, as shown and described. 